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Micro, Nano & Bio Electronics at Georgia Tech PRC - September 19th, 2007

Automotive, Computer, Mobile Communications, Defense, Consumer & Health Industries

Packaging Research Center • Manufacturing Research Center Bldg. Auditorium • Atlanta, Georgia 30332

INFO & REGISTRATION: www.prc.gatech.edu/events/indforum07

No charge for this event. Registration deadline is September 14, 2007

Georgia Tech, Atlanta GA, USA extend a warm welcome to you and to your company colleagues to join us for the Second 2007 Industry Forum Day to be held at Georgia Tech on September 19th, 2007.

Held in conjunction with the Packaging Research Center’s extensive Industrial Membership meeting, this event will feature industry keynote talks by industry executives, Georgia Tech’s Micro, Nano and Bio Systems Research, Supply Chain Company involvement and Student Poster Papers in RF, Optical, Thermal, Mechanical, and Bio Sensor Electronics.

We anticipate attendance by technical leaders and managers from around the world representing both academia and industry. The day’s activities will include several sessions:

* Industry Keynote Session with Focus on Future Technology Directions in IC, Packaging and Systems for automotive, consumer, computer, mobile communication and bioelectronics
* Student Recruiting & Internships in ECE, ME, ChE and MSE Areas
* Student Poster Papers in all the above fields

Please join us by registering before September 14, 2007 . There is no charge for this event.

REGISTER HERE

We also invite you to learn more about the
Consortia Development Programs at the Packaging Research Center
INDUSTRY-ACADEMIA CONSORTIA DEVELOPMENT,

MSDT: Mixed Signal Design and Tools Consortium
EMAP: Embedded Actives & Passives Consortium
TIM: Next Generation Thermal Interface Materials Consortium
ETFT: Electrical Test and Fault Tolerance for System-In-Package/System-On-Package
NANOPACK: Nano Packaging, Components, & Systems Consortium
NGFCS: Next-Generation Flip Chip to Cu-Ultra Low K and Advanced Organic Substrates Consortium
RFSOP:RF SOP Consortium
3DSiSOP: 3D Silicon SOP (Coming soon.)

Latest Program Developments

Last update: September 11, 2007

8:30~9:50 AM: SESSION 1: System Packaging Technology and Market Trends,
Chair, Prof. Rao Tummala

* Brian Swiggett, Managing Partner, Prismark Partners, “Technology and Market for SIP, SOC and SOP”
* Yuki Fukumoto, General Manager, Panasonic, “JISSO Technologies for Consumer Electronics Products”

Coffee Break: 9:50~10:15 AM

* Gary Schuster, Provost and Chief Academic Officer at Georgia Tech, “Globalization of GT”

10:15 AM~11:50 PM: SESSION 2: RF/Wireless Platform Technology
Chair, Prof. Madhavan Swaminathan

* Tom Gregorich, V.P. of Package Engineering, Qualcomm
* John Cressler, Professor at Georgia Tech, “Si-Ge Design and RF SOCs: Enabling 21st Century Mixed-Signal Circuits and Systems ”

Lunch: 12:00~1:30 PM

1:30 PM~3:30 PM: SESSION 3: Biomedical Electronics and Interfacing Systems
Chair, Dr. Mahadevan Iyer

* Peter Hesketh, Professor at Georgia Tech
* Paul Gerrish, Director of Packaging Technology, Medtronics
* Maysam Ghovanloo, Professor at Georgia Tech, “Highly Efficient Wideband Neural Interfacing Systems”

Coffee Break: 3:30~4:00 PM

4:00~6:00 PM: SESSION 4: Student Poster and Career Fair – Companies and Students
Chair, Dr. Chong Yoon

4:00~5:30 PM: Industry and Students: One-on-one and Student Posters

5:30~6:00PM: PRC Lab Tour—Substrate Lab and Assembly/Test Labs

6:00~7:30 PM: Industry Reception

General PRC Contact Information

Ph: 404-894-9097
Fax: 404-894-3842
prcinfo@ece.gatech.edu
www.prc.gatech.edu

POSTAL ADDRESS:
Packaging Research Center
813 Ferst Street, Room 351
Atlanta, GA 30332-0560

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